What are the main materials of bidirectional polyimide film
1、 Chemical composition of basic materials
Main material: Aromatic polyimide polymer
The precursor polyamide acid (PAA) is formed by condensation of aromatic dianhydride monomers and aromatic diamine monomers in polar solvents. It is then subjected to casting, longitudinal and transverse synchronous stretching, and high-temperature thermal imidization to form a rigid imide heterocycl
1、 Chemical composition of basic materials
Main material: Aromatic polyimide polymer
The precursor polyamide acid (PAA) is formed by condensation of aromatic dianhydride monomers and aromatic diamine monomers in polar solvents. It is then subjected to casting, longitudinal and transverse synchronous stretching, and high-temperature thermal imidization to form a rigid imide heterocyclic polymer film.
Two mainstream basic formulas on the market (industrial universal)
1. System (HN type, brown yellow universal BOPI)
Monomer: Phthalic dianhydride (PMDA)+4,4 '- diaminodiphenyl ether (ODA)
That is to say, the PMDA-ODA system is the mainstream raw material for 6052 biaxially oriented PI films in China.
2. High modulus low expansion system (FCCL/display substrate)
Monomer: Biphenyltetracarboxylic acid dianhydride (BPDA)+p-phenylenediamine (PPD)
The BPDA-PPD system has a higher modulus and lower coefficient of thermal expansion, and is commonly used in flexible circuits.
Other modified models: transparent colorless PI, black conductive PI, fluorine-containing PI will replace the dianhydride/diamine monomer structure.
2、 Composition division of ingredients
1. Main resin (over 97%): Aromatic polyimide
The molecule contains a stable acylimine five membered heterocyclic ring and aromatic benzene ring structure, which determines the basic properties of high temperature resistance, insulation, and chemical resistance.
2. Trace functional additives (added as needed)
Inorganic fillers (such as silica): reduce thermal expansion and improve dimensional stability
Flame retardant additives, antioxidants, surface modifiers;
Conductive carbon black (black BOPI specific)
The solvent (DMAC/NMP) is only used in the production process, and the solvent in the finished film is almost completely removed, which is not a component of the finished material.
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