What is the function of special functional polyimide film
Basic characteristics of ordinary polyimide film: high and low temperature resistance (-269 ℃~280 ℃ long-term use, short-term 400 ℃), high insulation, radiation resistance, flame retardancy, chemical corrosion resistance, commonly known as "golden film". Special functional polyimide film is a type of film made by doping fillers, surface coating, molecular modification, and composite coating on a b
Basic characteristics of ordinary polyimide film: high and low temperature resistance (-269 ℃~280 ℃ long-term use, short-term 400 ℃), high insulation, radiation resistance, flame retardancy, chemical corrosion resistance, commonly known as "golden film". Special functional polyimide film is a type of film made by doping fillers, surface coating, molecular modification, and composite coating on a basic PI substrate, which endows it with special functions such as thermal conductivity, conductive shielding, low dielectric, transparency, corona resistance, thermal precursor, and photosensitivity. It is used in harsh working conditions that ordinary PI films cannot meet and is widely used in the fields of electronic semiconductors, new energy vehicles, rail transit, aerospace, and communication.
Core functions of various functional films
1. Anti corona function PI film
Function: Enhance resistance to electrical aging, withstand pulse voltage impact, prevent partial discharge damage, and maintain insulation life at high temperatures.
Application: Insulation for traction motors, wind turbines, variable frequency high-power motors in rail transit, high-speed rail traction systems, solving the problem of rapid aging and failure of insulation caused by variable frequency voltage impact. It is a core special insulation material for rail transit.
2. Low dielectric/low loss PI film (fluorinated modified MPI)
Function: Reduce dielectric constant and signal loss, minimize signal delay and leakage under high frequency conditions, and ensure the integrity of high-speed signal transmission.
Application: 5G/6G RF antenna, high-speed flexible circuit board FPC, semiconductor packaging, suitable for high-frequency communication, to meet the needs of high-speed data transmission.
3. Conductive/Electromagnetic Shielding PI Film (Metallized PI)
Function: While retaining high temperature resistance and flexibility, it achieves conductive grounding, electromagnetic shielding, blocks external electromagnetic interference, and prevents internal signal leakage.
Applications: New energy battery modules, automotive electronics, flexible electromagnetic shielding for communication equipment, flexible sensors; Surface copper, nickel, and gold can be directly used as flexible conductive substrates to replace some metal shielding structures and achieve lightweight.
4. Thermal conductive PI film, graphite precursor PI film
Function: Fill with thermal conductive filler to achieve in-plane thermal conductivity; The graphite precursor PI undergoes high-temperature graphitization to prepare a high thermal conductivity graphite heat dissipation film, which has a thermal conductivity far exceeding that of copper and aluminum, and can dissipate heat generated by chips and batteries.
Applications: mobile phones, foldable screens, power battery pack cooling, semiconductor chip cooling, consumer electronics thermal management.
5. Colorless and transparent CPI polyimide film
Function: Breaking the traditional yellow color of PI, achieving high transparency while retaining its high temperature resistance, million fold resistance, and impact resistance, replacing brittle glass.
Application: Folding phone cover, flexible OLED display substrate, optical window, realizing the foldable feature of flexible display devices.
6. Aerospace grade aluminum plated modified PI film
Function: Resistant to cosmic ray radiation, atomic oxygen, thermal insulation, low volatility in vacuum environment, reflects thermal radiation, and achieves internal temperature control of spacecraft.
Applications: Multi layer insulation components for satellites (gold insulation film), insulation for spacecraft wiring harnesses, flexible solar cell substrates, and core thermal control materials for spacecraft.
7. Photosensitive polyimide film
Function: It has the ability of photolithography patterning and can directly expose and develop to form circuit patterns, simplifying semiconductor microfabrication processes.
Application: 2.5D/3D chip packaging, RDL for wafer rewiring layer, MEMS microelectromechanical devices, greatly simplifying the chip manufacturing process
8. Functional cover film (black/white PI functional film)
Black PI covering film: light shielding+electromagnetic shielding+insulation, used for FPC flexible circuit boards to block light interference and shield stray signals.
White high reflective PI film: resistant to high temperatures, yellowing, and high reflectivity, used for LED light strips and car headlight backlighting to improve light efficiency.
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