Where are special functional polyimide films generally used
Special functional polyimide film is based on ordinary PI substrate, which is endowed with special properties such as high thermal conductivity, transparency, low dielectric, conductive shielding, corona resistance, photosensitivity, and low thermal expansion through doping, surface modification, and composite coating. It is mainly used in harsh working conditions that ordinary PI film cannot meet
Special functional polyimide film is based on ordinary PI substrate, which is endowed with special properties such as high thermal conductivity, transparency, low dielectric, conductive shielding, corona resistance, photosensitivity, and low thermal expansion through doping, surface modification, and composite coating. It is mainly used in harsh working conditions that ordinary PI film cannot meet, and is mainly applied in the following industries:
1. Semiconductor and chip packaging
Chip passivation layer, buffer layer, and rewiring RDL substrate; The substrate and sacrificial layer of MEMS microelectromechanical sensors;
Low CTE (coefficient of thermal expansion) PI, matched with silicon wafer thermal expansion, reduces thermal stress generated by high and low temperature cycles, and prevents chip cracking;
Photosensitive PI film, directly formed by photolithography, simplifies microstructure processing and is used for wafer post packaging.
2. Flexible display (CPI transparent polyimide)
Folding screen phones, transparent flexible substrates for curled OLED, replacing glass, capable of withstanding hundreds of thousands of bends;
Equipped with a touch layer and polarizing film substrate, it has high transparency, low yellowing, and low expansion, solving the pain points of bending and screen breakage.
3. 5G/High speed Communication Electronics (Low dielectric PI)
High frequency high-speed FPC flexible circuit board substrate (MPI modified PI), reducing signal transmission loss;
Insulated substrates for mobile phones, internal antennas of base stations, RF lines, and high-speed connectors;
High frequency flexible circuits for high-speed servers and AI computing power boards.
4. New energy vehicles and power batteries
CCS integrated busbar insulation film, cell insulation isolation layer, and PACK module insulation protection for power batteries;
Drive motor with corona resistant PI insulation film, high-voltage cable insulation coating;
High thermal conductivity PI film, as a precursor of graphite heat dissipation film, is used for consumer electronics and server heat dissipation after carbon graphitization.
5. Aerospace and satellite (radiation resistant PI)
Satellite multi-layer thermal control blanket (golden PI film), resistant to extreme high and low temperatures in space, cosmic rays, and atomic oxygen erosion;
Onboard avionics cable bundle insulation, aircraft sensor substrate; Low volatile formula, meeting the requirements of space vacuum environment and avoiding the precipitation of pollutants.
6. Rail transit and wind power equipment (corona resistant PI)
High speed railway traction motors and wind turbine generators have H-grade insulation films that can withstand long-term pulse high voltage and corona aging;
High power transformers, special motors with inter turn insulation.
7. Photovoltaic and new energy storage
Flexible photovoltaic cell backplate, thin film solar cell substrate, resistant to ultraviolet radiation, moisture and heat aging;
Insulation and heating film substrate (PI electric heating film) for energy storage battery modules;
8. Medical and flexible sensing
Wearable flexible sensors, medical minimally invasive catheter substrates;
Can withstand high temperature and high pressure ethylene oxide, gamma ray sterilization, and biocompatible PI for surface monitoring electrodes.
9. Industrial Electronics
High temperature PI tape substrate (lithium battery high temperature tape, SMT masking tape);
Micro capacitor dielectric layer, special heating film.
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