What are the applications of online thickness gauges in the semiconductor industry
The online thickness gauge is the core precision testing equipment for the entire semiconductor manufacturing process, with non-contact, nanometer level accuracy, and real-time closed-loop as its core advantages. It runs through wafer manufacturing, thin film deposition, photolithography, thinning CMP、 Key processes such as metallization and packaging ensure process stability, improve yield, and r
The online thickness gauge is the core precision testing equipment for the entire semiconductor manufacturing process, with non-contact, nanometer level accuracy, and real-time closed-loop as its core advantages. It runs through wafer manufacturing, thin film deposition, photolithography, thinning CMP、 Key processes such as metallization and packaging ensure process stability, improve yield, and reduce costs. The following are its core application scenarios and values:
1、 Wafer Manufacturing and Epitaxial Growth
1. Online detection of silicon wafer/substrate thickness
Real time measurement of the thickness and uniformity of native silicon wafers, silicon carbide (SiC), gallium nitride (GaN) and other substrates to ensure that the initial thickness of the wafer meets the process standards and provides a benchmark for subsequent processes.
2. Epitaxy thickness monitoring
Online monitoring of growth rate and thickness uniformity of silicon epitaxy, GaN epitaxy, SiC epitaxy, etc., real-time feedback of temperature, gas flow rate, cavity pressure and other parameters to avoid device performance failure caused by thickness deviation, supporting mass production of large-sized wafers such as 12 inches.
2、 Thin film deposition process (CVD/PECVD/ALD/PVD)
1. Thickness measurement of dielectric film
Real time measurement of insulation/isolation layer thickness for silicon oxide (SiO ₂), silicon nitride (Si ∝ N ₄), silicon oxynitride (SiO ₓ N ᵧ), and high-k dielectrics, with an accuracy of ± 0.1nm, ensuring device insulation and reducing leakage current.
2. Thickness measurement of metal/barrier layer
Monitor the thickness of metal interconnect layers and barrier layers such as titanium (Ti), titanium nitride (TiN), tungsten (W), aluminum (Al), copper (Cu), etc., to ensure conductivity and diffusion barrier ability, and avoid short circuits/open circuits.
3. Thickness measurement of polycrystalline/amorphous silicon
The thickness and uniformity of the polycrystalline silicon layer used for gate, floating gate, resistor and other structures are controlled online, which directly affects the threshold voltage and electrical characteristics of the device.
3、 Photolithography process
1. Thickness measurement of photoresist
Real time detection of photoresist thickness uniformity after spin coating ensures exposure dose matching, pattern resolution, and line width accuracy, which is a key control point in the process (7nm/5nm and below).
2. Thickness measurement of anti reflective coating (BARC/DARC)
Measure the thickness of the bottom/top anti reflection layer online, control the light reflectivity below 1%, improve the quality of lithography imaging, and reduce pattern distortion.
4、 Wafer thinning and CMP (chemical mechanical polishing)
1. Back Grinding for online thickness measurement
Non contact real-time monitoring of the process of wafer thinning from 750 μ m to 50-200 μ m, measuring the true thickness of the silicon substrate through the blue film protective layer, achieving correct endpoint control, and avoiding excessive thinning, fragmentation, or thickness affecting packaging.
2. CMP thickness and uniformity monitoring
Real time measurement of polished wafer/film thickness, feedback of pressure, speed, slurry flow rate and other parameters to ensure global planarization effect, laying the foundation for multi-layer stacking process.
5、 Metalization and Packaging
1. Thickness measurement of electroplated/solder layers (XRF/optical)
Online detection of copper (Cu), gold (Au), nickel (Ni), tin silver (SnAg) and other under bump metal layer (UBM), solder bumps, redistribution layer (RDL) thickness and uniformity, ensuring solder joint reliability and reducing precious metal waste.
2. TSV (Through Silicon Via) depth/thickness measurement
Detect TSV etching depth and filling metal thickness to ensure the electrical performance and mechanical strength of vertical interconnects.
3. Packaging substrate/stack thickness detection
Online measurement of total thickness and interlayer thickness for glass substrates, organic substrates, and 3D stacked chips to meet the high-precision requirements of packaging (2.5D/3D IC).
6、 MEMS and Compound Semiconductors
1. MEMS thin film/structure thickness measurement
Measure the thickness of functional layers such as silicon film, aluminum nitride (AlN), and piezoelectric thin film to ensure the mechanical and electrical performance of MEMS sensors and actuators.
2. Monitoring of compound semiconductor film thickness
Used for online control of epitaxial layer, quantum well, and contact layer thickness in optoelectronic/RF devices such as GaAs, InP, GaN, etc., to improve device luminescence efficiency, frequency characteristics, and consistency.
WeChat number：
Home
Product
Wechat
Telephone