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What are the applications of bidirectional polyimide films in the electronics industry

Source:www.cshuaqiang.com      Release date: 2025-07-15
Biaxially oriented polyimide film is a high-performance special polymer material that combines excellent high temperature resistance, insulation, mechanical strength, chemical corrosion resistance, and dimensional stability. It is widely used in various electronic devices and precision components in the electronics industry. The following are its main application scenarios:
       Biaxially oriented polyimide film is a high-performance special polymer material that combines excellent high temperature resistance, insulation, mechanical strength, chemical corrosion resistance, and dimensional stability. It is widely used in various electronic devices and precision components in the electronics industry. The following are its main application scenarios:
1、 Flexible Printed Circuit Board (FPC) field
1. Substrate and Cover Film:
       Bidirectional polyimide film is one of the core substrates of flexible circuit boards, which can serve as an insulating substrate for FPC and carry copper foil circuits. Its high temperature resistance (long-term use temperature up to 200-300 ℃) and strong solder resistance can meet the high temperature environmental requirements of FPC during welding and assembly processes; At the same time, its excellent mechanical flexibility allows it to adapt to the bending and folding needs of FPC (such as mobile phone cables and laptop hinge lines).
      In addition, it can also serve as a cover film (protective coating) for FPC, isolating external water vapor and dust, preventing circuit oxidation or short circuit, and improving the reliability and service life of FPC.
2. Flexible display substrate:
      In flexible OLED displays, bidirectional polyimide films can serve as the core material for flexible substrates, replacing traditional glass substrates, supporting organic light-emitting layers, and withstanding high-temperature evaporation, laser processing, and other processes in the display manufacturing process. Moreover, their lightweight and bendable characteristics are suitable for the folding and curling needs of flexible screens.
2、 Insulation materials and electronic packaging field
1. High temperature insulation pads and partitions:
      With good electrical insulation performance (volume resistivity>10 ¹⁶Ω· cm, dielectric strength>100kV/mm), bidirectional polyimide film is commonly used for high-temperature insulation components of electronic devices, such as insulation pads and winding insulation layers of transformers, motors, and capacitors, especially suitable for electronic equipment in high-frequency and high-temperature environments (such as new energy vehicle motors and aerospace transformers).
2. Electronic packaging and shielding materials:
      In the packaging of precision electronic components such as chips and sensors, bidirectional polyimide film can serve as an insulating encapsulation layer to protect the components from external environmental influences; Meanwhile, through surface metallization treatments such as copper plating and aluminum plating, shielding films can be made for electromagnetic shielding of electronic devices, reducing signal interference (such as 5G communication equipment and radar components).
3、 Thermal and heat dissipation components
1. Flexible thermal pad/heat dissipation film:
      Partial bidirectional polyimide films can be made into flexible thermal conductive films by filling with thermal conductive fillers (such as graphene, alumina), which have both insulation and thermal conductivity, and are used for chips LED、 The heat dissipation interface of power batteries and other components can replace traditional silicone gaskets, especially suitable for narrow spaces or flexible heat dissipation scenarios.
4、 Electronic tape and adhesive products
1. High temperature resistant tape substrate:
      After surface treatment, the bidirectional polyimide film can be coated with special adhesive to make high-temperature resistant electronic tape, which is used for PCB board welding shielding, lithium battery pole ear fixation, temporary fixation of flexible circuit boards, etc. It can withstand high temperature reflow soldering (above 260 ℃) and has no residual adhesive after peeling, meeting the cleanliness requirements of precision electronic processing.
5、 Special electronic components and new energy field
1. Lithium battery separator and electrode substrate:
      In lithium batteries, bidirectional polyimide films can serve as high-temperature resistant separators to prevent membrane melting caused by high temperatures during battery short circuits; In addition, its good chemical stability makes it suitable as a substrate for electrode current collectors, improving the cycle life and safety of batteries.
2. Sensors and Aerospace Electronics:
      Due to its radiation resistance, high and low temperature resistance (-269 ℃ to over 300 ℃), and good dimensional stability, bidirectional polyimide film is suitable for sensor insulation layers in the aerospace industry, flexible circuits in satellite communication equipment, and protection of electronic components in extreme environments.